4

Leadless Device Marking

Leaded Device Marking

COMPLIANCE INDICATOR,*

DATE CODE, SUFFIX (IF NEEDED)

Avago QYYWWZ

XXXXXX

XXXXXXX

XXX USA

* 50434

COUNTRY OF MFR.

Avago FSCN*

Avago LOGO

DLA SMD*

PIN ONE/

ESD IDENT

Avago P/N

DLA SMD*

* QUALIFIED PARTS ONLY

COMPLIANCE INDICATOR,*

DATE CODE, SUFFIX (IF NEEDED)

Avago QYYWWZ

XXXXXX

* XXXX

XXXXXX

USA 50434

DLA SMD*

Avago FSCN*

Avago LOGO

COUNTRY OF MFR.

Avago P/N

PIN ONE/

ESD IDENT

DLA SMD*

* QUALIFIED PARTS ONLY

Hermetic Optocoupler Options

Option

Description

100

Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on

commercial and hi-rel product in 8 pin DIP (see drawings below for details).

200

Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel product in

8 pin DIP. DLA Drawing part numbers contain provisions for leadfinish. All leadless chip carrier devices are

delivered with solder dipped terminals as a standard feature.

300

Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is

available on commercial and hi-rel product in 8 pin DIP (see drawings below for details). This option has

solder dipped leads.

*Solder contains lead.

1.14 (0.045)

1.40 (0.055)

4.32 (0.170)

MAX.

0.51 (0.020)

MAX.

2.29 (0.090)

2.79 (0.110)

0.51 (0.020)

MIN.

7.36 (0.290)

7.87 (0.310)

0.20 (0.008)

0.33 (0.013)

Note: Dimensions in millimeters (inches).

0.51 (0.020)

MIN.

4.57 (0.180)

MAX.

0.51 (0.020)

MAX.

2.29 (0.090)

2.79 (0.110)

1.40 (0.055)

1.65 (0.065)

9.65 (0.380)

9.91 (0.390)

5° MAX.

4.57 (0.180)

MAX.

0.20 (0.008)

0.33 (0.013)

Note: Dimensions in millimeters (inches).

1.07 (0.042)

1.32 (0.052)