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BA30BC0FP-E2 数据表(PDF) 8 Page - Rohm |
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BA30BC0FP-E2 数据表(HTML) 8 Page - Rohm |
8 / 19 page 8/16 BAxxBC0 Series BAxxBC0W Series BA00BC0WCP-V5 Datasheet TSZ02201-0R6R0A600120-1-2 TSZ22111・15・001 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 26.Jun.2012 Rev.001 Application Information ●I/O equivalence circuit ●Power Dissipation • TO220FP-3/TO220FP-5/TO220FP-5 V5) • TO252-3/TO252-5 The characteristics of the IC are greatly influenced by the operating temperature. If the temperature exceeds the maximum junction temperature Tjmax, deterioration or damage may occur. Implement proper thermal designs to ensure that power dissipation is within the permissible range in order to prevent instantaneous damage resulting from heat and maintain the reliability of the IC for long-term operation. The following method is used to calculate the power consumption Pc (W). Pc = (Vcc – Vo) × Io + Vcc × Icca Power dissipation Pd ≧ Pc The load current Io is calculated: Calculation Example: Vcc = 6.0 V and Vo = 5.0 V at Ta = 85°C 31k Ω 2k Ω 27k Ω CTL Vcc R2 R1 Vcc OUT Fig.16 Fig.17 * For the BA00BC0WT, connect R1 and R2 externally between the C and GND pins and between the OUT and C pins. Fig.18 Fig.19 0 15 25 20 10 5 25 50 75 125 150 100 0 AMBIENT TEMPERATURE:Ta [°C] (1)20.0 (2)2.0 (2) During IC without heat sink operation. θj-a = 62.5 (°C/W) (1) When using an infinite heat sink. θj-c = 6.25 (°C/W) 0 1.2 2.0 1.6 0.8 0.4 25 50 75 125 150 100 0 AMBIENT TEMPERATURE:Ta [°C] 1.30 IC mounted on a ROHM standard board Board size: 70 × 70 × 1.6 mm Copper foil area: 7 × 7 mm TO252-5 θja=96.2 (°C/W) TO252-3 θja=104.2 (°C/W) TO252-5 TO252-3 θja = 96.2°C/W → −10.4mW/°C 25°C = 1300mW → 85°C = 676mW Vcc : Input voltage Vo : Output current IO : Load current Icca : Circuit current Io ≦ Pd − Vcc × Icca Vcc − Vo Io≦ 0.676 − 6.0 × Icca 6.0 − 5.0 Io ≦ 550mA (Icca ≈ 20mA) Equation: VO = Vc × (R1 + R2) / R1 (Vc = 1.25 V (Typ.)) The recommended R1 value is approximately 30 k Ω to 150 kΩ. |
类似零件编号 - BA30BC0FP-E2 |
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类似说明 - BA30BC0FP-E2 |
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