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SM15T22AY 数据表(PDF) 4 Page - STMicroelectronics |
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SM15T22AY 数据表(HTML) 4 Page - STMicroelectronics |
4 / 12 page Characteristics SM15TY 4/12 Doc ID 17865 Rev 3 Figure 3. Peak pulse power dissipation versus initial junction temperature (typical values) Figure 4. Peak pulse power versus exponential pulse duration (Tj initial = 25 °C) 0 500 1000 1500 2000 0 25 50 75 100 125 150 175 P (W) PP T (°C) j 10/1000 µs 0.1 1.0 10.0 100.0 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 P (kW) PP tp (ms) Figure 5. Clamping voltage versus peak pulse current (exponential waveform, maximum values) Figure 6. Junction capacitance versus reverse applied voltage for unidirectional types (typical values) I (A) PP 0.1 1.0 10.0 100.0 1000.0 1 10 100 1000 10/1000 µs 8/20 µs V (V) CL T = 25 °C j initial C(pF) 100 1000 10000 1 10 100 1000 SM15T6V8AY SM15T30AY SM15T82AY V (V) R F = 1 MHz V = 30 mV T = 25 °C OSC RMS j Figure 7. Junction capacitance versus reverse applied voltage for bidirectional types (typical values) Figure 8. Thermal resistance junction to ambient versus copper surface under each lead C(pF) 100 1000 10000 1 10 100 1000 SM15T6V8CAY SM15T30CAY SM15T82CAY F = 1 MHz V = 30 mV T = 25 °C OSC RMS j V (V) R 0 10 20 30 40 50 60 70 80 90 100 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 R (°C/W) th(j-a) S (cm²) Cu Printed circuit board FR4, copper thickness = 35 µm |
类似零件编号 - SM15T22AY |
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类似说明 - SM15T22AY |
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