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5-1394723-3 数据表(PDF) 4 Page - STMicroelectronics

部件名 5-1394723-3
功能描述  Connectivity Systems for PV Manufacturers
Download  44 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

5-1394723-3 数据表(HTML) 4 Page - STMicroelectronics

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SOLARLOK Connectivity Systems for PV Manufacturers
te.com/solar
Catalog 3-1773458-7 | Issue Date 04/2011
Dimensions are in inches and millimeters unless otherwise specified.
Values in brackets are standard equivalents. Dimensions are shown
for reference purposes only. Specifications subject to change.
USA: 1-800-522-6752
Latin/S. America: +54 (0) 11-4733-2200
France: +33 (0) 1-3420-8686
Canada: +1-905-475-6222
Germany: +49 (0) 6251-133-1999
Netherlands: +31 (0) 73-6246-999
Mexico: +52 (0) 55-1106-0800
UK: +44 (0) 800-267666
China: +86 (0) 400-820-6015
2
Mechanical, Environmental and Electrical Testing Capabilities
Force-deflection curves are generated to verify that
spring contact properties meet design criteria.
3D X-ray computer tomography provides high
resolution three-dimensional non-destructive
analysis capability.
Contact resistance and temperature rise are measured
and recorded automatically. These parameters help to
establish/verify current carrying capacity, and de-rating
curves. Test samples are isolated to minimize the
influence of external variables such as air movement.
Components/assemblies are exposed to cold, heat,
moisture, and temperature change. Thermal shock
is accomplished with the 2-chamber method.
Environmental chambers operate from -70°C to +180°C
enabling simulation of real-world conditions.
Slow-motion bending and vibration testing simulates
line movements in the wire, stressing the crimped
termination. Industrial atmospheres are generated
with a gas mixture of SO2, H2S, NO2 and Cl2.


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