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HLMP-BD16-RU0XX 数据表(PDF) 9 Page - AVAGO TECHNOLOGIES LIMITED

部件名 HLMP-BD16-RU0XX
功能描述  5mm mini Oval Precision Optical Performance AlInGaP Lamps
Download  12 Pages
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制造商  AVAGO [AVAGO TECHNOLOGIES LIMITED]
网页  http://www.avagotech.com
标志 AVAGO - AVAGO TECHNOLOGIES LIMITED

HLMP-BD16-RU0XX 数据表(HTML) 9 Page - AVAGO TECHNOLOGIES LIMITED

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Precautions:
Lead Forming:
• TheleadsofanLEDlampmaybepreformedorcutto
lengthpriortoinsertionandsolderingonPCboard.
• For better control, it is recommended to use proper
tooltopreciselyformandcuttheleadstoapplicable
lengthratherthandoingitmanually.
• Ifmanualleadcuttingisnecessary,cuttheleadsafter
thesolderingprocess.Thesolderconnectionformsa
mechanicalgroundwhichpreventsmechanicalstress
duetoleadcuttingfromtravelingintoLEDpackage.
Thisishighlyrecommendedforhandsolderoperation,
astheexcessleadlengthalsoactsassmallheatsink.
Soldering and Handling:
• CaremustbetakenduringPCBassemblyandsoldering
processtopreventdamagetotheLEDcomponent.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidablecircumstancessuchasrework.Theclosest
manualsolderingdistanceofthesolderingheatsource
(solderingiron’stip)tothebodyis1.59mm.Soldering
the LED using soldering iron tip closer than 1.59mm
mightdamagetheLED.
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
settingisused.So,itisrecommendedtore-calibratethesoldering
profileagainbeforeloadinganewtypeofPCB.
2. AvagoTechnologies’highbrightnessLEDareusinghighefficiency
LEDdiewithsinglewirebondasshownbelow.Customerisadvised
to take extra precaution during wave soldering to ensure that the
maximumwavetemperaturedoesnotexceed250°Candthesolder
contacttimedoesnotexceeding3sec.Over-stressingtheLEDduring
solderingprocessmightcauseprematurefailuretotheLEDdueto
delamination.
Avago Technologies LED configuration
1.59mm
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
DorefertoAvagoapplicationnoteAN1142fordetails.
Thesolderingironusedshouldhavegroundedtipto
ensureelectrostaticchargeisproperlygrounded.
• Recommendedsolderingcondition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heattemperature
105°CMax.
-
Preheattime
60secMax
-
Peaktemperature
250°CMax.
260°CMax.
Dwelltime
3secMax.
5secMax
Note:
1) Above conditions refers to measurement with thermocouple
mountedatthebottomofPCB.
2) Itisrecommendedtouseonlybottompreheatersinordertoreduce
thermalstressexperiencedbyLED.
• Wavesolderingparametersmustbesetandmaintained
accordingtotherecommendedtemperatureanddwell
time.Customerisadvisedtoperformdailycheckonthe
solderingprofiletoensurethatitisalwaysconforming
torecommendedsolderingconditions.
Note:ElectricalconnectionbetweenbottomsurfaceofLEDdieand
theleadframeisachievedthroughconductivepaste.
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
notapplyweightorforceonLED.Nonmetalmaterial
isrecommendedasitwillabsorblessheatduringwave
solderingprocess.
• At elevated temperature, LED is more susceptible to
mechanicalstress.Therefore,PCBmustallowedtocool
down to room temperature prior to handling, which
includesremovalofalignmentfixtureorpallet.
• IfPCBboardcontainsboththroughhole(TH)LEDand
othersurfacemountcomponents,itisrecommended
that surface mount components be soldered on the
topsideofthePCB.Ifsurfacemountneedtobeonthe
bottom side, these components should be soldered
usingreflowsolderingpriortoinsertiontheTHLED.
• Recommended PC board plated through holes (PTH)
sizeforLEDcomponentleads.
LED component
lead size
Diagonal
Plated through
hole diameter
0.45x0.45mm
(0.018x0.018inch)
0.636mm
(0.025inch)
0.98to1.08mm
(0.039to0.043inch)
0.50x0.50mm
(0.020x0.020inch)
0.707mm
(0.028inch)
1.05to1.15mm
(0.041to0.045inch)
• Over-sizing the PTH can lead to twisted LED after
clinching.OntheotherhandundersizingthePTHcan
causedifficultyinsertingtheTHLED.
AllnGaP Device
CATHODE


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