FDS8936A Rev.B

0

5

10

15

20

0

2

4

6

8

10

Q

, GATE CHARGE (nC)

g

I = 6A

D

V

= 5V

DS

10V

20V

0.1

0.2

0.5

1

2

5

10

30

50

0.01

0.05

0.1

0.5

1

2

5

10

30

50

V

, DRAIN-SOURCE VOLTAGE (V)

RDS(ON)

LIMIT

A

DC

DS

1s

100ms

10ms

1ms

10s

V

=10V

SINGLE PULSE

R

= 135 °C/W

T

= 25°C

θJA

GS

A

100us

0.01

0.1

0.5

1

10

50 100

300

0

5

10

15

20

25

30

SINGLE PULSE TIME (SEC)

SINGLE PULSE

R

=135° C/W

T = 25°C

θJA

A

Figure 10. Single Pulse Maximum Power

Dissipation.

0.1

0.2

0.5

1

2

5

10

30

50

100

200

400

800

1200

2000

V

, DRAIN TO SOURCE VOLTAGE (V)

DS

Ciss

f = 1 MHz

V

= 0 V

GS

Coss

Crss

Figure 8. Capacitance Characteristics.

Figure 7. Gate Charge Characteristics.

Figure 9. Maximum Safe Operating Area

.

Typical Electrical Characteristics

(continued)

0.0001

0.001

0.01

0.1

1

10

100

300

0.001

0.002

0.005

0.01

0.02

0.05

0.1

0.2

0.5

1

t , TIME (sec)

1

Single Pulse

D = 0.5

0.1

0.05

0.02

0.01

0.2

Duty Cycle, D = t /t

1

2

R

(t) = r(t) * R

R

=135 °C/W

θJA

θJA

θJA

T - T

= P * R

(t)

A

J

P(pk)

Figure 11. Transient Thermal Response Curve.

Thermal characterization performed using the conditions described in Note 1c.

Transient

thermal response will change depending on the circuit board design.