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FDC6323 数据表(PDF) 2 Page - Fairchild Semiconductor |
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FDC6323 数据表(HTML) 2 Page - Fairchild Semiconductor |
2 / 10 page Electrical Characteristics (T A = 25°C unless otherwise noted) Symbol Parameter Conditions Min Typ Max Units OFF CHARACTERISTICS I FL Forward Leakage Current V IN = 8 V, VON/OFF = 0 V 1 µA I RL Reverse Leakage Current V IN = -8 V, VON/OFF = 0 V -1 µA ON CHARACTERISTICS (Note 3) V IN Input Voltage 3 8 V V ON/OFF On/Off Voltage 1.5 8 V V DROP Conduction Voltage Drop @ 1A V IN = 5 V, VON/OFF = 3.3 V 0.145 0.2 V V IN = 3.3 V, VON/OFF = 3.3 V 0.178 0.3 I L Load Current V DROP = 0.2 V, VIN = 5 V, VON/OFF = 3.3 V 1 A V DROP = 0.3 V, VIN = 3.3 V, VON/OFF = 3.3 V 1 Notes: 1. V IN=8V, VON/OFF=8V, VDROP=0.5V, TA=25 oC 2. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. PD (t) = TJ−TA R θJ A(t) = TJ −T A R θJ C+RθCA(t) = I D 2 (t) × R DS (ON)@T J Typical RθJA for single device operation using the board layouts shown below on FR-4 PCB in a still air environment: a. 180 oC/W when mounted on a 2oz minimum copper pad. Scale 1 : 1 on letter size paper 3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0% FDC6323L Rev.F 2a |
类似零件编号 - FDC6323 |
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类似说明 - FDC6323 |
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