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TC1304 数据表(PDF) 6 Page - Transcom, Inc.

部件名 TC1304
功能描述  Low Noise and Medium Power GaAs FETs
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制造商  TRANSCOM [Transcom, Inc.]
网页  http://www.transcominc.com.tw
标志 TRANSCOM - Transcom, Inc.

TC1304 数据表(HTML) 6 Page - Transcom, Inc.

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TC1304
REV5_20070502
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
6 / 6
SCHEMATIC
TOM2 MODEL PARAMETERS
Parameters
Parameters
VTO
-0.393 V
VMAX
0.5 V
ALPHA
6.47
CGD
0.0754 pF
BETA
0.4622
CGS
6.18 pF
GAMMA 0.0394
CDS
0.1313 pF
DELTA
0.3935
RIS
2.2 Ohm
Q
0.78
RID
0.001 Ohm
NG
0.1
VBR
9 V
ND
0.01
RDB
120 Ohm
TAU
4.255 ps
CBS
0.042 pF
RG
1.2 Ohm
TNOM
25 ℃
RD
1.29 Ohm
LS
0.01 nH
RS
1.594 Ohm
LG
0.041 nH
IS
1E-11 mA
LD
0.04 nH
N
1
AFAC
1
VBI
1 V
NFING
1
VDELTA
0.2 V
CHIP HANDLING
DIE ATTACHMENT: Conductive epoxy or eutectic die attach is recommended. For eutectic die attach can be
accomplished with Au-Sn (80%Au-20%Sn) perform in State Temperature: 290℃± 5 ℃ ; Handling Tool :
Tweezers ; Time: less than 1min .
WIRE BONDING: The recommended wire bond method is thermo-compression bonding with 0.7 or 1.0 mil
(0.018 or 0.025mm) gold wire. Stage Temperature: 220
°C to 250°C ; Bond Tip Temperature : 150℃ ; Bond Force:
20 to 30 gms depending on size of wire and Bond Tip Temperature.
HANDLING PRECAUTIONS: The user must operate in a clean, dry environment. Care should be exercised
during handling avoid damage to the devices. Electrostatic Discharge (ESD) precautions should be observed at all
stages of storage, handling, assembly, and testing. The static discharge must be less than 300V.
Cgs
Cgd
Cds
Rg
Rd
Rdb
Ris
Rs
Id
Lg
Ld
Ls
Cbs
Rid


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