integration to help break down barriers to RF implementation such as stringent power, performance, size and

cost requirements helping bring wireless connectivity to new applications.

From an IC architecture perspective, integration is almost always a good thing. With ULP designs, the benefits

are particularly helpful. Of the five important components of a harvesting system – conversion, temporary

storage, power management circuits, analog converters and ULP MCUs – the last four are the most likely first

step toward high integration.

In fact, TI’s MSP430 MCU family already integrates many high-performance analog and controller functions

needed for energy-harvesting applications. The addition of power management and the radio circuits are all

that is required – and that formula is exactly what TI’s new CC430 platform will deliver.

The full MSP430 MCU peripheral set will be available on the CC430 devices including intelligent, high-

performance digital and analog peripherals like a 12-bit ADC, and comparators that provide high performance

even during RF transmissions and consume no power when not in operation. These peripherals also speed

design by integrating functions such as an integrated Advanced Encryption Standard (AES) accelerator that

encrypts and decrypts data sent wirelessly for more secure alarm and industrial monitoring systems.

With a 50 percent reduction in printed circuit board (PCB) space, CC430-based devices help enable

smaller devices in a wide variety of wireless applications. Examples may include smart hospital tracking that

can communicate patient or medical equipment information to a central location or personal area networking

between sports watches, pedometers, chest-strap heart-rate monitors and PC-based health and fitness anal-

ysis programs. Smaller board space and reduced complexity also help shrink the size of heat-cost allocators

and AMI smart metering systems, which are expected to make up 28 percent of all electric meters by 2013.

In addition to delivering low-power advantages, integration also reduces package size and cost which is a

high priority for small sensor applications that might be deployed, for example, in a mesh network or some

other “network of things” – for example, innovative RF sensor networks that report data to a central collec-

tion to analyze and regulate information such as smoke in the atmosphere to detect forest fires, moisture or

pesticide information in crop fields or even humidity levels in a winery.

According to the ARC Advisory Group, the worldwide market for industrial applications of wireless technol-

ogy will grow at a 32 percent compound annual growth rate (CAGR) over the next five years, and is projected

to exceed U.S. $1 billion in 2010.

A major stumbling block to date in deploying wireless technology in industrial settings has always been

powering the radio and the application circuits. Both installation and periodic maintenance have been identi-

fied as being problematic. If line power has to be extended to the application, the value of wireless communi-

cation is reduced. If batteries are used, they have to be replaced from time to time.

Integration adds

value

Energy Harvesting

April 2010

6

Texas Instruments