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TMP47C202MG 数据表(PDF) 3 Page - Toshiba Semiconductor |
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TMP47C202MG 数据表(HTML) 3 Page - Toshiba Semiconductor |
3 / 42 page TMP47C102/202 II 2008-03-06 1. Part number 2. Package code and dimensions Previous Part Number (in Body Text) Previous Package Code (in Body Text) New Part Number New Package Code OTP TMP47C102P P-DIP20-300-2.54A TMP47C102PG DIP20-P-300-2.54A TMP47P202VPG TMP47C102M P-SOP20-300-1.27 TMP47C102MG SOP20-P-300-1.27 TMP47P202VMG TMP47C202P P-DIP20-300-2.54A TMP47C202PG DIP20-P-300-2.54A TMP47P202VPG TMP47C202M P-SOP20-300-1.27 TMP47C202MG SOP20-P-300-1.27 TMP47P202VMG *: For the dimensions of the new package, see the attached Package Dimensions diagram. 3. Addition of notes on lead solderability The following solderability test is conducted on the new device. Lead solderability of Pb-free devices (with the G suffix) Test Test Conditions Remark Solderability (1) Use of Lead (Pb) · solder bath temperature = 230°C · dipping time = 5 seconds · the number of times = once · use of R-type flux (2) Use of Lead (Pb)-Free · solder bath temperature = 245°C · dipping time = 5 seconds · the number of times = once · use of R-type flux Leads with over 95% solder coverage till lead forming are acceptable. |
类似零件编号 - TMP47C202MG |
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类似说明 - TMP47C202MG |
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