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LC0406FC3.3C - LC0406FC36C

soLDeR ReFLow inFoRMation

PRinteD CiRCuit BoaRD ReCoMMenDations

PaRaMeteR

vaLue

Pad Size on PCB

0.275mm

Pad Shape

Round

Pad Definition

Non-Solder Mask Defined Pads

Solder Mask Opening

0.325mm Round

Solder Stencil Thickness

0.150mm

Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)

0.330mm Round

Solder Paste Type

No Clean

Pad Protective Finish

OSP (Entek Cu Plus 106A)

Tolerance - Edge To Corner Ball

±50µm

Solder Ball Side Coplanarity

±20µm

Maximum Dwell Time Above Liquidous (183°C)

60 seconds

Soldering Maximum Temperature

270°C

t

P

30-60 seconds

Ramp-up

15 seconds

(Minimize)

solder-time

15-20 seconds

Ramp-Down

Ramp-Down

solder Melt

(Maximum temp)

Maximum solder Reflow

(35-53°C above Maximum solder Melt temp)

Ramp-up

Preheat

(stay Below Flux activation temp)

ReCoMMenDeD non-soLDeR MasK

DeFineD PaD iLLustRation

non-solder Mask Defined Pad

0.275mm Dia.

solder Mask opening

0.325mm Dia.

solder stencil opening

0.330mm Dia.

RequiReMents

Temperature:

T

T

Preheat time and temperature depends on solder paste and flux activa-

tion temperature, component size, weight, surface area and plating.