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CXA1619BS 数据表(PDF) 11 Page - Sony Corporation |
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CXA1619BS 数据表(HTML) 11 Page - Sony Corporation |
11 / 11 page SONY CODE EIAJ CODE JEDEC CODE SOP-28P-L04 PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS 42/COPPER ALLOY SOLDER PLATING EPOXY RESIN 28PIN SOP (PLASTIC) 18.8 – 0.1 + 0.4 15 28 0.45 ± 0.1 1.27 2.3 – 0.15 + 0.4 0.1 – 0.05 + 0.2 0.2 – 0.05 + 0.1 14 M 0.24 SOP028-P-0375 1 0.7g 0.15 SONY CODE EIAJ CODE JEDEC CODE 30PIN SDIP (PLASTIC) 26.9 – 0.1 + 0.4 15 16 30 1.778 0° to 15° 0.5 ± 0.1 0.9 ± 0.15 SDIP-30P-01 SDIP030-P-0400 1 PACKAGE STRUCTURE MOLDING COMPOUND LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN PLATING COPPER ALLOY 1.8g SOLDER/PALLADIUM 1.All mat surface type. Two kinds of package surface: 2.All mirror surface type. Package Outline Unit : mm CXA1619BM CXA1619BS CXA1619BM/BS —11— NOTE : PALLADIUM PLATING This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame). |
类似零件编号 - CXA1619BS |
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类似说明 - CXA1619BS |
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