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TSC2007-Q1 数据表(PDF) 2 Page - Texas Instruments |
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TSC2007-Q1 数据表(HTML) 2 Page - Texas Instruments |
2 / 39 page PENIRQ I C Serial Interface and Control 2 SCL SDA A[0:1] X+ X- Y+ Y- AUX TEMP Mux VDD/REF GND SAR ADC Internal Clock Touch Screen Drivers Interface TSC2007-Q1 SBAS545 – SEPTEMBER 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) TA PACKAGE ORDERABLE PART NUMBER TOP-SIDE MARKING –40°C to +85°C TSSOP – PW Reel of 2000 TSC2007IPWRQ1 TS2007I (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted). PARAMETER VALUE UNIT Analog input X+, Y+, AUX to GND –0.4 to VDD + 0.1 V Voltage Analog input X –, Y– to GND –0.4 to VDD + 0.1 V Voltage range VDD/REF pin to GND –0.3 to +5 V Digital input voltage to GND –0.3 to VDD + 0.3 V Digital output voltage to GND –0.3 to VDD + 0.3 V Power dissipation (TJ Max - TA)/θJA Thermal impedance, θJA TSSOP package 86 °C/W Operating free-air temperature range, TA –40 to +85 °C Storage temperature range, TSTG –65 to +150 °C Junction temperature, TJ Max +150 °C Vapor phase (60 sec) +215 °C Lead temperature Infrared (15 sec) +220 °C IEC contact discharge(2) X+, X –, Y+, Y– ±15 kV IEC air discharge(2) X+, X –, Y+, Y– ±25 kV (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability. (2) Test method based on IEC standard 61000-4-2. Contact Texas Instruments for test details. 2 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TSC2007-Q1 |
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