Micrel, Inc.

SM802121

January 2012

4

M9999-011212-A

Absolute Maximum Ratings

(1)

Lead Temperature (soldering, 20s)............................ 260°C

Case Temperature ..................................................... 115°C

Operating Ratings

(2)

Junction Thermal Resistance

(3)

QFN (

Still-Air......................................................... 50°C/W

QFN (

Junction-to-Board ....................................... 30°C/W

DC Electrical Characteristics

(4)

Symbol

Parameter

Condition

Min.

Typ.

Max.

Units

2.5V Operating Voltage

2.375

2.5

2.625

V

3.3V Operating Voltage

3.135

3.3

3.465

V

XTAL_SEL = 0; REF_IN source, outputs open

78

100

mA

XTAL_SEL = 1; CRYSTAL source, outputs open

88

114

mA

LVPECL DC Electrical Characteristics

(4)

Symbol

Parameter

Condition

Min.

Typ.

Max.

Units

Output High Voltage

V

Output Low Voltage

V

Output Voltage Swing

0.6

0.8

1.0

V

Notes:

1.

Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied

at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended

periods may affect device reliability.

2.

The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

3.

Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.

4.

The circuit is designed to meet the AC and DC specifications shown in the above table(s) after thermal equilibrium has been established.