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SI3458BDV 数据表(PDF) 9 Page - Vishay Siliconix |
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SI3458BDV 数据表(HTML) 9 Page - Vishay Siliconix |
9 / 11 page AN823 Vishay Siliconix www.vishay.com 2 Document Number: 71743 27-Feb-04 255 − 260_C 1X4_C/s (max) 3-6_C/s (max) 10 s (max) Reflow Zone Pre-Heating Zone 3_C/s (max) 140 − 170_C Maximum peak temperature at 240_C is allowed. FIGURE 3. Solder Reflow Temperature and Time Durations 60-120 s (min) 217_C 60 s (max) THERMAL PERFORMANCE A basic measure of a device’s thermal performance is the junction-to-case thermal resistance, Rqjc, or the junction-to-foot thermal resistance, Rqjf. This parameter is measured for the device mounted to an infinite heat sink and is therefore a characterization of the device only, in other words, independent of the properties of the object to which the device is mounted. Table 1 shows the thermal performance of the TSOP-6. TABLE 1. Equivalent Steady State Performance—TSOP-6 Thermal Resistance Rqjf 30_C/W SYSTEM AND ELECTRICAL IMPACT OF TSOP-6 In any design, one must take into account the change in MOSFET rDS(on) with temperature (Figure 4). 0.6 0.8 1.0 1.2 1.4 1.6 −50 −25 0 25 50 75 100 125 150 VGS = 4.5 V ID = 6.1 A On-Resistance vs. Junction Temperature TJ − Junction Temperature (_C) FIGURE 4. Si3434DV |
类似零件编号 - SI3458BDV |
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类似说明 - SI3458BDV |
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