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BA30BC0WFP 数据表(PDF) 5 Page - Rohm

部件名 BA30BC0WFP
功能描述  1A Secondary LDO Regulators for Local Power Supplies
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制造商  ROHM [Rohm]
网页  http://www.rohm.com
标志 ROHM - Rohm

BA30BC0WFP 数据表(HTML) 5 Page - Rohm

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BA□□BC0 Series,BA□□BC0W Series,BA00BC0W Series
Technical Note
5/8
www.rohm.com
2010.02 - Rev.B
© 2010 ROHM Co., Ltd. All rights reserved.
Input / Output Equivalent Circuit Diagrams
Thermal Derating Curves
 TO220FP-3/TO220FP-5/TO220FP-5V5)
 TO252-3/TO252-5
Fig.18
Fig.19
The characteristics of the IC are greatly influenced by the operating temperature. If the temperature exceeds the maximum
junction temperature Tjmax, deterioration or damage may occur. Implement proper thermal designs to ensure that power
dissipation is within the permissible range in order to prevent instantaneous damage resulting from heat and maintain the
reliability of the IC for long-term operation.
The following method is used to calculate the power consumption Pc (W).
Pc = (Vcc – Vo)
 Io + Vcc  Icca
Power dissipation Pd ≥ Pc
The load current Io is calculated:
Calculation Example:
Vcc = 6.0 V and Vo = 5.0 V at Ta = 85°C
Refer to the above and implement proper thermal designs so that the IC will not be used under excessive power dissipation
conditions under the entire operating temperature range.
The power consumption Pc of the IC in the event of shorting (i.e. the Vo and GND pins are shorted) can be obtained from the
following equation:
Pc = Vcc
 (Icca + Ishort) (Ishort: short current).
0
15
25
20
10
5
25
50
75
125
150
100
0
AMBIENT TEMPERATURE:Ta [°C]
(1)20.0
(2)2.0
(2) During IC without heat sink operation.
j-a = 62.5 (°C/W)
(1) When using an infinite heat sink.
j-c = 6.25 (°C/W)
ja = 96.2°C/W → −10.4 mW/°C
25°C = 1300 mW → 85°C = 676 mW
31kΩ
2kΩ
27kΩ
CTL
Vcc
R2
R1
Vcc
OUT
Fig.16
Fig.17
Vcc : Input voltage
Vo
: Output current
IO
: Load current
Icca : Circuit current
* For the BA00BC0WT, connect R1 and
R2 externally between the C and GND
pins and between the OUT and C pins.
0
1.2
2.0
1.6
0.8
0.4
25
50
75
125
150
100
0
AMBIENT TEMPERATURE:Ta [°C]
1.30
IC mounted on a ROHM standard board
Board size: 70
 70  1.6 mm
Copper foil area: 7
 7 mm
TO252-5
ja=96.2 (°C/W)
TO252-3
ja=104.2 (°C/W)
TO252-5
TO252-3
Equation: VOUT = Vc
 (R1 + R2) / R1
(Vc = 1.25 V (Typ.))
The recommended R1 value is
approximately 30 k
 to 150 k.
Io ≤
Pd − Vcc
 Icca
Vcc − Vo
0.676 − 6.0
 Icca
6.0 − 5.0
Io ≤ 550 mA (Icca
 20 mA)


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