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ISL59483 数据表(PDF) 11 Page - Intersil Corporation |
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ISL59483 数据表(HTML) 11 Page - Intersil Corporation |
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11 / 17 page  11 FN6394.2 May 21, 2007 FIGURE 36. MUX 1: HIZ SWITCHING GLITCH VIN = 0V FIGURE 37. MUX 2: HIZ SWITCHING GLITCH VIN = 0V FIGURE 38. MUX 1: HIZ TRANSIENT RESPONSE VIN = 1V FIGURE 39. MUX 2: HIZ TRANSIENT RESPONSE VIN = 1V FIGURE 40. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE FIGURE 41. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE Typical Performance Curves VS = ±5V, RL = 500Ω to GND, TA = +25°C, unless otherwise specified. (Continued) 10ns/DIV 0 0 VIN = 0V VOUT A, B, C HIZ 50 Ω TERM. 20ns/DIV 0 0 VIN = 0V VOUT A, B, C HIZ 50 Ω TERM. VIN=1V 10ns/DIV 0 0 VOUT A, B, C 50 Ω TERM. HIZ VIN = 1V 20ns/DIV 0 0 VOUT A, B, C 50 Ω TERM. HIZ JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD - QFN EXPOSED DIEPAD SOLDERED TO PCB PER JESD51-5 6 5 4 3 2 1 0 0 25 50 75 100 150 AMBIENT TEMPERATURE (°C) 4.34W θJA=+23°C/ QFN48 125 85 JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD - QFN EXPOSED DIEPAD SOLDERED TO PCB PER JESD51-5 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 25 50 75 100 150 870mW θJA=+115°C/ QFN48 125 85 AMBIENT TEMPERATURE (°C) ISL59483 |
类似零件编号 - ISL59483 |
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类似说明 - ISL59483 |
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