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ADXL206HDZ 数据表(PDF) 4 Page - Analog Devices |
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ADXL206HDZ 数据表(HTML) 4 Page - Analog Devices |
4 / 12 page ADXL206 Rev. 0 | Page 4 of 12 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating Acceleration (Any Axis) Unpowered 500 g Powered 500 g VS −0.3 V to +7.0 V All Other Pins (COM − 0.3 V) to (VS + 0.3 V) Output Short-Circuit Duration (Any Pin to Common) Indefinite Ambient Operating Temperature Range (TA) −55°C to +175°C Storage Temperature Range −65°C to +200°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, for a device soldered in a printed circuit board (PCB) for surface-mount packages. Table 3. Thermal Resistance Package Type θJA θJC Unit 8-Lead SBDIP 120 20 °C/W ESD CAUTION tP tL TIME 25°C TO PEAK tS PREHEAT CRITICAL ZONE TL TO TP TIME RAMP-DOWN RAMP-UP TSMIN TSMAX TP TL Figure 2. Recommended Soldering Profile Table 4. Recommended Soldering Profile Limits Profile Feature Sn63/Pb37 Pb-Free Average Ramp Rate (TL to TP) 3°C/sec max 3°C/sec max Preheat Minimum Temperature (TSMIN) 100°C 150°C Maximum Temperature (TSMAX) 150°C 200°C Time (TSMIN to TSMAX), tS 60 sec to 120 sec 60 sec to 150 sec Ramp-Up Rate (TSMAX to TL) 3°C/sec max 3°C/sec max Time Maintained Above Liquidous (tL) 60 sec to 150 sec 60 sec to 150 sec Liquidous Temperature (TL) 183°C 217°C Peak Temperature (TP) 240°C + 0°C/−5°C 260°C + 0°C/−5°C Time Within 5°C of Actual Peak Temperature (tP) 10 sec to 30 sec 20 sec to 40 sec Ramp-Down Rate (TP to TL) 6°C/sec max 6°C/sec max Time 25°C to Peak Temperature 6 minutes max 8 minutes max |
类似零件编号 - ADXL206HDZ |
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类似说明 - ADXL206HDZ |
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