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LC66358C 数据表(PDF) 3 Page - Sanyo Semicon Device |
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LC66358C 数据表(HTML) 3 Page - Sanyo Semicon Device |
3 / 25 page Pin Assignments We recommend the use of reflow-soldering techniques to solder-mount QFP packages. Please consult with your Sanyo representative for details on process conditions if the package itself is to be directly immersed in a dip-soldering bath (dip-soldering techniques). No. 5483-3/25 LC662304A, 662306A, 662308A, 662312A, 662316A 1 DIP42S P20/SI0 2 P21/SO0 3 P22/SCK0 4 P23/INT0 5 P30/INT1 6 P31/POUT0 7 P32/POUT1 8 VSS 9 OSC1 10 OSC2 11 VDD 12 RES 13 PE0 14 PE1 15 TEST 16 P33/HOLD 17 P40/INV01 18 P41/INV00 19 P42/INV11 20 P43/INV10 21 P50 42 P13 41 P12 40 P11 39 P10 38 P03 37 P02 36 P01 35 P00 34 PD3/INV30 LC662304A 2306A 2308A 2312A 2316A 33 PD2/INV31 32 PD1/INV20 31 PD0/INV21 30 PC3 29 PC2 28 P63/PIN1 27 P62/DT 26 P61 25 P60/ML 24 P53/INT2 23 P52 22 P51 QFP48E LC662304A 2306A 2308A 2312A 2316A 36 37 P03 1 35 2 34 3 33 4 32 5 31 6 30 7 29 8 28 9 27 10 26 11 25 12 24 P61 38 P10 23 P60/ML 39 P11 22 P53/INT2 40 P12 21 P52 41 P13 20 P51 42 NC 19 NC 43 NC 18 NC 44 P20/SI0 17 P50 45 P21/SO0 16 P43/INV1O 46 P22/SCK0 15 P42/INV1I 47 P23/INT0 14 P41/INV0O 48 P30/INT1 13 P40/INV0I Top view |
类似零件编号 - LC66358C |
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类似说明 - LC66358C |
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