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SN74AUP1G08YFPR 数据表(PDF) 2 Page - Texas Instruments

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部件名 SN74AUP1G08YFPR
功能描述  LOW-POWER SINGLE 2-INPUT POSITIVE-AND GATE
Download  22 Pages
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

SN74AUP1G08YFPR 数据表(HTML) 2 Page - Texas Instruments

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AUP
LVC
AUP
AUP
LVC
Static-Power Consumption
(
µA)
Dynamic-Power Consumption
(pF)
Single, dual, and triple gates
3.3-V
Logic
3.3-V
Logic
0%
20%
40%
60%
80%
100%
0%
20%
40%
60%
80%
100%
−0.5
0
0.5
1
1.5
2
2.5
3
3.5
0
5
10
15
20
25
30
35
40
45
Time − ns
AUP1G08 data at CL = 15 pF
Output
Input
Switching Characteristics
at 25 MHz
Y + A • B or Y + A ) B
1
2
4
A
B
Y
SN74AUP1G08
SCES502J – NOVEMBER 2003 – REVISED MAY 2010
www.ti.com
Figure 1. AUP – The Lowest-Power Family
Figure 2. Excellent Signal Integrity
This single 2-input positive-AND gate performs the Boolean function
in positive logic.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION(1)
ORDERABLE
TOP-SIDE
TA
PACKAGE(2)
PART NUMBER
MARKING(3)
NanoStar™ – WCSP (DSBGA)
Reel of 3000
SN74AUP1G08YFPR
_ _ _HE_
0.23-mm Large Bump – YFP (Pb-free)
NanoStar™ – WCSP (DSBGA)
Reel of 3000
SN74AUP1G08YZPR
_ _ _HE_
0.23-mm Large Bump – YZP (Pb-free)
QFN – DRY
Reel of 5000
SN74AUP1G08DRYR
HE
–40°C to 85°C
uQFN – DSF
Reel of 5000
SN74AUP1G08DSFR
HE
SOT (SOT-23) – DBV
Reel of 3000
SN74AUP1G08DBVR
H08_
SOT (SC-70) – DCK
Reel of 3000
SN74AUP1G08DCKR
HE_
SOT (SOT-553) – DRL
Reel of 4000
SN74AUP1G08DRLR
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2)
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3)
DBV/DCK/DRL: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YFP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
INPUTS
OUTPUT
Y
A
B
L
L
L
L
H
L
H
L
L
H
H
H
LOGIC DIAGRAM (POSITIVE LOGIC)
2
Submit Documentation Feedback
Copyright © 2003–2010, Texas Instruments Incorporated
Product Folder Link(s): SN74AUP1G08


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