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FEATURES

DCT OR DCU PACKAGE

(TOP VIEW)

1

2

3

4

8

7

6

5

A1

A2

GND

B1

B2

DIR

YZP PACKAGE

(BOTTOM VIEW)

4

3

2

1

5

6

7

8

GND

A2

A1

DIR

B2

B1

D1

D2

C2

C1

B1

B2

A1

A2

DESCRIPTION/ORDERING INFORMATION

SN74AVC2T45

DUAL-BIT DUAL-SUPPLY BUS TRANSCEIVER

WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS

SCES531J – DECEMBER 2003 – REVISED JUNE 2007

• Available in the Texas Instruments

NanoFree™ Package

• Control Inputs V

• Fully Configurable Dual-Rail Design Allows

Each Port to Operate Over the Full 1.2-V to

3.6-V Power-Supply Range

• I/Os Are 4.6-V Tolerant

• I

Operation

• Max Data Rates

–

500 Mbps (1.8-V to 3.3-V Translation)

–

320 Mbps (<1.8-V to 3.3-V Translation)

–

320 Mbps (Translate to 2.5 V or 1.8 V)

–

280 Mbps (Translate to 1.5 V)

–

240 Mbps (Translate to 1.2 V)

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Protection Exceeds JESD 22

–

8000-V Human-Body Model (A114-A)

–

200-V Machine Model (A115-A)

–

1000-V Charged-Device Model (C101)

This dual-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is

translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoFree™ – WCSP (DSBGA)

Reel of 3000

SN74AVC2T45YZPR

_ _ _TD_

0.23-mm Large Bump – YZP (Pb-free)

–40

°C to 85°C

SSOP – DCT

Reel of 3000

SN74AVC2T45DCTR

DT2_ _ _

VSSOP – DCU

Reel of 3000

SN74AVC2T45DCUR

DT2_

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(3)

DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2003–2007, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.