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SS24 数据表(PDF) 4 Page - Analog Devices |
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SS24 数据表(HTML) 4 Page - Analog Devices |
4 / 28 page ADP2300/ADP2301 Rev. 0 | Page 4 of 28 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating VIN, EN −0.3 V to +28 V SW −1.0 V to +28 V BST to SW −0.6 V to +6 V BST −0.3 V to +28 V FB −0.3 V to +3.3 V Operating Junction Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C Soldering Conditions JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in combination. Unless otherwise specified, all voltages are referenced to GND. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 3. Thermal Resistance1 Package Type θJA θJC Unit 6-Lead TSOT 186.02 66.34 °C/W 1 θ JA and θ JC are measured using natural convection on a JEDEC 4-layer board. ESD CAUTION |
类似零件编号 - SS24 |
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类似说明 - SS24 |
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