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LSBKS9UG3392 数据表(PDF) 7 Page - LIGITEK electronics co., ltd. |
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LSBKS9UG3392 数据表(HTML) 7 Page - LIGITEK electronics co., ltd. |
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7 / 7 page  1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Solderability Test Solder Resistance Test Thermal Shock Test High Temperature High Humidity Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test High Temperature Storage Test Operating Life Test Test Item Reliability Test: MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Description Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/6 PART NO. LSBKS9UG3392 |
类似零件编号 - LSBKS9UG3392 |
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类似说明 - LSBKS9UG3392 |
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