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LFD435-6A-XX-RP39-PF 数据表(PDF) 9 Page - LIGITEK electronics co., ltd. |
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LFD435-6A-XX-RP39-PF 数据表(HTML) 9 Page - LIGITEK electronics co., ltd. |
9 / 10 page Solderability Test Solder Resistance Test Reliability Test: High Temperature High Humidity Test Thermal Shock Test Low Temperature Storage Test High Temperature Storage Test Operating Life Test Test Item PART NO. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to see soldering well performed or not. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hous. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Test Condition LFD435/6A-XX/RP39-PF Description The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. Page 8/8 |
类似零件编号 - LFD435-6A-XX-RP39-PF |
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类似说明 - LFD435-6A-XX-RP39-PF |
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