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LA183B-1-230-F 数据表(PDF) 5 Page - LIGITEK electronics co., ltd. |
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LA183B-1-230-F 数据表(HTML) 5 Page - LIGITEK electronics co., ltd. |
5 / 6 page MIL-STD-202:103B JIS C 7021: B-11 1.Ta=65℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs High Temperature High Humidity Test The purpose of this test is the resistance of the device under tropical for hous. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Solderability Test 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test Thermal Shock Test MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Reliability Test: Description The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test Operating Life Test Test Item Test Condition MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/4 PART NO. LA183B-1/230-F |
类似零件编号 - LA183B-1-230-F |
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类似说明 - LA183B-1-230-F |
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