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LA62B-3-YG-3 数据表(PDF) 6 Page - LIGITEK electronics co., ltd. |
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LA62B-3-YG-3 数据表(HTML) 6 Page - LIGITEK electronics co., ltd. |
6 / 6 page Thermal Shock Test Solder Resistance Test High Temperature High Humidity Test Solderability Test MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hous. Operating Life Test Reliability Test: Low Temperature Storage Test High Temperature Storage Test MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Test Item Test Condition This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. Description Page 5/5 Reference Standard PART NO. LA62B-3/YG-3 |
类似零件编号 - LA62B-3-YG-3 |
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类似说明 - LA62B-3-YG-3 |
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