TLC251, TLC251A, TLC251B, TLC251Y

LinCMOS

™ PROGRAMMABLE

LOW-POWER OPERATIONAL AMPLIFIERS

SLOS001E – JULY 1983 – REVISED AUGUST 1994

3

POST OFFICE BOX 655303

TLC251Y chip information

These chips, properly assembled, display characteristics similar to the TLC251C. Thermal compression or

ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive

epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJMAX = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

PIN (4) IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

+

–

OUT

BIAS SELECT

IN +

IN –

OFFSET N1

OFFSET N2

VDD

VDD – /GND

(7)

(6)

(8)

(3)

(2)

(1)

(5)

(4)

48

55

(2)

(1)

(8)

(7)

(6)

(5)

(3)

(4)