PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

5962-86844012A

ACTIVE

LCCC

FK

20

1

None

Call TI

Level-NC-NC-NC

5962-8684401DA

ACTIVE

CFP

W

14

1

None

Call TI

Level-NC-NC-NC

JM38510/37301B2A

ACTIVE

LCCC

FK

20

1

None

Call TI

Level-NC-NC-NC

JM38510/37301BCA

ACTIVE

CDIP

J

14

1

None

Call TI

Level-NC-NC-NC

SN54ALS02AJ

ACTIVE

CDIP

J

14

1

None

Call TI

Level-NC-NC-NC

SN54AS02J

ACTIVE

CDIP

J

14

1

None

Call TI

Level-NC-NC-NC

SN74ALS02AD

ACTIVE

SOIC

D

14

50

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

SN74ALS02ADR

ACTIVE

SOIC

D

14

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

SN74ALS02AN

ACTIVE

PDIP

N

14

25

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

SN74ALS02AN3

OBSOLETE

PDIP

N

14

None

Call TI

Call TI

SN74ALS02ANSR

ACTIVE

SO

NS

14

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

SN74AS02D

ACTIVE

SOIC

D

14

50

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

SN74AS02DR

ACTIVE

SOIC

D

14

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

SN74AS02N

ACTIVE

PDIP

N

14

25

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

SN74AS02N3

OBSOLETE

PDIP

N

14

None

Call TI

Call TI

SN74AS02NSR

ACTIVE

SO

NS

14

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

SNJ54ALS02AFK

ACTIVE

LCCC

FK

20

1

None

Call TI

Level-NC-NC-NC

SNJ54ALS02AJ

ACTIVE

CDIP

J

14

1

None

Call TI

Level-NC-NC-NC

SNJ54ALS02AW

ACTIVE

CFP

W

14

1

None

Call TI

Level-NC-NC-NC

SNJ54AS02FK

ACTIVE

LCCC

FK

20

1

None

Call TI

Level-NC-NC-NC

SNJ54AS02J

ACTIVE

CDIP

J

14

1

None

Call TI

Level-NC-NC-NC

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

temperature.

PACKAGE OPTION ADDENDUM

www.ti.com

28-Feb-2005

Addendum-Page 1