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TDA8172 数据表(PDF) 4 Page - STMicroelectronics |
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TDA8172 数据表(HTML) 4 Page - STMicroelectronics |
4 / 5 page 1 4 5 1N4001 C1 C2 D1 C3 220 µF 470 µF 0.1 µF 63 2 7 R1 RT1 10k Ω 4.7k Ω V S C4 0.22 µF R7 1.5 Ω C6 4.7 µF R3 R4 R2 5.6k Ω 12k Ω 8.2k Ω C5 R5 R6 Ly Iy 24.6mH Ry 2200 µF 330 Ω 9.6 Ω R5 Iy to Vi to GND IN to t fly 7 V * REF Re comme nde d for V filtering V REF 8.2 Ω TDA8172 Figure 2 : AC Test Circuit Figure 3 : Mounting Examples MOUNTING INSTRUCTIONS The power dissipated in the circuit must be re- moved by adding an external heatsink. Thanks to the HEPTAWATT TM package attaching the heatsink is very simple, a screw or a compres- sion spring (clip) being sufficient. Between the heatsink and the package it is better to insert a layer of silicon grease, to optimize the thermal contact ; no electrical isolation is needed between the two surfaces, since the tab is con- nected to Pin 4 which is ground. TDA8172 4/5 |
类似零件编号 - TDA8172 |
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类似说明 - TDA8172 |
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