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SI5445BDC 数据表(PDF) 1 Page - Vishay Siliconix |
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SI5445BDC 数据表(HTML) 1 Page - Vishay Siliconix |
1 / 6 page FEATURES D TrenchFETr Power MOSFET Si5445BDC Vishay Siliconix New Product Document Number: 73251 S-50133—Rev. A, 24-Jan-05 www.vishay.com 1 P-Channel 1.8-V (G-S) MOSFET PRODUCT SUMMARY VDS (V) rDS(on) (W) ID (A) Qg (Typ) 0.033 @ VGS = −4.5 V −7.1 −8 0.043 @ VGS = −2.5 V −6.2 14 0.060 @ VGS = −1.8 V −5.3 1206-8 ChipFE Tr D D D G D D D S 1 Bottom View Marking Code BM XX Lot Traceability and Date Code Part # Code S G D P-Channel MOSFET Ordering Information: Si5445BDC-T1—E3 ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED) Parameter Symbol 5 secs Steady State Unit Drain-Source Voltage VDS −8 V Gate-Source Voltage VGS "8 V Continuous Drain Current (TJ = 150_C)a TA = 25_C ID −7.1 −5.2 Continuous Drain Current (TJ = 150_C)a TA = 85_C ID −5.2 −3.7 A Pulsed Drain Current IDM "20 A Continuous Source Currenta IS −2.1 −1.1 Maximum Power Dissipationa TA = 25_C PD 2.5 1.3 W Maximum Power Dissipationa TA = 85_C PD 1.3 0.7 W Operating Junction and Storage Temperature Range TJ, Tstg −55 to 150 _C Soldering Recommendations (Peak Temperature)b, c 260 _C THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit Mi J ti t A bi ta t v 5 sec R 45 50 Maximum Junction-to-Ambienta Steady State RthJA 85 95 _C/W Maximum Junction-to-Foot (Drain) Steady State RthJF 17 20 C/W Notes a. Surface Mounted on 1” x 1” FR4 Board. b. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder intercon- nection. c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. |
类似零件编号 - SI5445BDC |
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类似说明 - SI5445BDC |
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