Analog Integrated Circuit Device Data

8

Freescale Semiconductor

34704

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 3. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit

ELECTRICAL RATINGS

Battery Input Supply Voltage (VIN) Pin

PVINx, RST, ONOFF, LION, DRV7(5), VG, SCL, SDA and VOUT1-5 Pins

VDDI, COMPx, FBx, VREF7(5), FREQ, and SS Pins

-0.3 to 6.0

-0.3 to 6.0

-0.3 to 3.0

V

SW1-5 Pins

-1.0 to 6.0

V

SW8, SW6(5) Pins

-1.0 to 27

V

BTx Pins (Referenced to switch node)

-0.3 to 6.0

V

BTx Pins to GND

-0.3 to 27

V

VOUT8, VOUT6(5) Pins

-0.3 to 27

V

VOUT7 Pin(5)

-10.0 to 0.3

V

Continuous Output Current

REG1(5)

REG2,5

REG3

REG4

REG6,7(5)

REG8

500

500

550

300

60

30

mA

ESD Voltage

Human Body Model

Charge Device Model

±1000

±500

V

THERMAL RATINGS

Maximum Junction Temperature

+150

°C

Storage Temperature

-65 to +150

°C

PD

2.5

W

THERMAL RESISTANCE(4)

Thermal Resistance

Junction to Ambient

Junction to Board

26

10

°C/W

Peak Package Reflow Temperature During Reflow(2),(3)

Note 3

°C

Notes

1.

2.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

3.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

4.

Thermal Resistance is based on a four-layer board (2s2p)

5.

Available only on the 34704A