0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

1E-2

1E-1

1E+0

1E+1

VFM(V)

IFM(A)

Tj=125°C

Fig. 7: Forward voltage drop versus forward

current (maximum values).

012

345

0

20

40

60

80

100

120

S(Cu) (cm²)

Rth(j-a) (°C/W)

P=1.5W

Fig. 8-1: Thermal resistance junction to ambient

versus copper surface under each lead (Epoxy

printed circuit board, copper thickness: 35

µm)(SMB).

01

2

3

4

5

0

20

40

60

80

100

120

140

P=1.5W

S(Cu) (cm²)

Rth(j-a) (°C/W)

Fig. 8-2: Thermal resistance junction to ambient

versus copper surface under each lead (Epoxy

printed circuit board, copper thickness: 35

µm)(SMA).

STPS140A/U

4/6