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AD8063ARZ-REEL7 数据表(PDF) 6 Page - Analog Devices |
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AD8063ARZ-REEL7 数据表(HTML) 6 Page - Analog Devices |
6 / 20 page AD8061/AD8062/AD8063 Rev. E | Page 6 of 20 ABSOLUTE MAXIMUM RATINGS Table 4. Parameter Rating Supply Voltage 8 V Internal Power Dissipation1 8-lead SOIC (R) 0.8 W 5-lead SOT-23 (RJ) 0.5 W 6-lead SOT-23 (RJ) 0.5 W 8-lead MSOP (RM) 0.6 W Input Voltage (Common-Mode) (−VS − 0.2 V) to (+VS − 1.8 V) Differential Input Voltage ±VS Output Short-Circuit Duration Observe power derating curves Storage Temperature Range R-8, RM-8, SOT-23-5, SOT-23-6 −65°C to +125°C Operating Temperature Range −40°C to +85°C Lead Temperature (Soldering, 10 sec) 300°C 1 Specification is for device in free air. 8-Lead SOIC_N: θJA = 160°C/W; θJC = 56°C/W. 5-Lead SOT-23: θJA = 240°C/W; θJC = 92°C/W. 6-Lead SOT-23: θJA = 230°C/W; θJC = 92°C/W. 8-Lead MSOP: θJA = 200°C/W; θJC = 44°C/W. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. MAXIMUM POWER DISSIPATION The maximum power that can be safely dissipated by the AD8061/AD8062/AD8063 is limited by the associated rise in junction temperature. The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the plastic, approximately 150°C. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of 175°C for an extended period can result in device failure. While the AD8061/AD8062/AD8063 is internally short-circuit protected, this may not be sufficient to guarantee that the maximum junction temperature (150°C) is not exceeded under all conditions. To ensure proper operation, it is necessary to observe the maximum power derating curves. AMBIENT TEMPERATURE (°C) 2.0 1.0 0 –50 –40 –30 70 80 90 1.5 0.5 60 50 40 30 0 –10 –20 20 10 TJ = 150°C MSOP SOT-23-5, SOT-23-6 8-LEAD SOIC PACKAGE Figure 6. Maximum Power Dissipation vs. Temperature for AD8061/AD8062/AD8063 ESD CAUTION |
类似零件编号 - AD8063ARZ-REEL7 |
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类似说明 - AD8063ARZ-REEL7 |
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