数据搜索系统,热门电子元器件搜索 |
|
ST1333 数据表(PDF) 3 Page - STMicroelectronics |
|
ST1333 数据表(HTML) 3 Page - STMicroelectronics |
3 / 13 page MICROMODULES 3/13 Table 3. Manufacturing Flow and Manufacturing Facility Locations Table 4. Material Specification Operation Location and Facility Wafer Diffusion Rousset, France. 6” wafer fab. Agrate, Italy. 6” wafer fab.: standard EEPROM only Electrical Wafer Test Rousset, France. Agrate, Italy: standard EEPROM only Assembly Casablanca, Morocco. Final Test Rousset, France. Casablanca, Morocco. Material Description Tape Basic material MCTS T2 or IBIDEN rough, typical thickness 120 µm Adhesive Modified epoxy, typical thickness 18 µm Laminated copper foil Typical thickness 35 µm Adhesive strength > 0.8 N/mm at room temperature. Monitored by the tape manufacturer using appropriate test methods Tape Surface The whole epoxy adhesive surface is controlled to be free of dirt, grease, cleaning compounds and parting compounds Surface roughness Typically Rz: 3-12 µm at first accepted delivery Contact surface Nickel-gold, galvanised treatment Nickel thickness 2 µm (min.) Gold thickness contact side, 0.1 µm (min.) Total tape thickness 160 ± 30 µm Control, Palmer “Special flat” diameter 3 mm, F = 1.5 N Chip Interconnect Dice bonding Silver epoxy Bonding wire Gold 25 µm Ring (D22 only) Bronze Protective coating Material UV epoxy, Black epoxy Assembly Casablanca, Morocco. |
类似零件编号 - ST1333 |
|
类似说明 - ST1333 |
|
|
链接网址 |
隐私政策 |
ALLDATASHEETCN.COM |
ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |