Analog Integrated Circuit Device Data

6

Freescale Semiconductor

34701

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

THERMAL RATINGS

Storage Temperature

-65 to 150

°C

Peak Package Reflow Temperature During Reflow(2), (3)

Note 3

°C

Maximum Junction Temperature

125

°C

Thermal Resistance

Junction to Ambient (Single Layer)(4), (5)

Junction to Ambient (Four Layers)(4), (5)

70

55

°C/W

Thermal Resistance, Junction to Base(6)

18

°C/W

Operational Package Temperature (Ambient Temperature)

-40 to 85

°C

Notes

2.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

3.

Freescale’s package reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL),

Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.

MC33xxxD enter 33xxx), and review parametrics.

4.

Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,

ambient temperature, air flow, power dissipation of other components on the board and board thermal resistance.

5.

Per JEDEC JESD51-6 with the board horizontal

6.

Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top

surface of the board near the package.

Table 2.

Maximum Ratings (continued)

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent

damage to the device.

Rating

Symbol

Value

Unit