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UC1526 数据表(PDF) 9 Page - Texas Instruments

部件名 UC1526
功能描述  Regulating Pulse Width Modulator
Download  13 Pages
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

UC1526 数据表(HTML) 9 Page - Texas Instruments

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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
85515012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
8551501VA
ACTIVE
CDIP
J
18
1
TBD
A42 SNPB
N / A for Pkg Type
UC1526J
ACTIVE
CDIP
J
18
1
TBD
A42 SNPB
N / A for Pkg Type
UC1526J883B
ACTIVE
CDIP
J
18
1
TBD
A42 SNPB
N / A for Pkg Type
UC1526L
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
UC1526L883B
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
UC2526AJ
ACTIVE
CDIP
J
18
1
TBD
A42 SNPB
N / A for Pkg Type
UC2526N
ACTIVE
PDIP
N
18
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC2526NG4
ACTIVE
PDIP
N
18
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC3526AJ
ACTIVE
CDIP
J
18
1
TBD
A42 SNPB
N / A for Pkg Type
UC3526DW
ACTIVE
SOIC
DW
18
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3526DWG4
ACTIVE
SOIC
DW
18
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3526DWTR
ACTIVE
SOIC
DW
18
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3526DWTRG4
ACTIVE
SOIC
DW
18
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3526N
ACTIVE
PDIP
N
18
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC3526NG4
ACTIVE
PDIP
N
18
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Addendum-Page 1


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