www.lansdale.com

Page 11 of 11

Issue A

LANSDALE Semiconductor, Inc.

ML12210

SO 16 = -5P

PLASTIC PACKAGE

(ML12210-5P)

CASE 751B–05

(SO–16)

ISSUE J

0.25 (0.010)

T

B

A

M

S

S

MIN

MIN

MAX

MAX

MILLIMETERS

INCHES

DIM

A

B

C

D

F

G

J

K

M

P

R

9.80

3.80

1.35

0.35

0.40

0.19

0.10

0°

5.80

0.25

10.00

4.00

1.75

0.49

1.25

0.25

0.25

7°

6.20

0.50

0.386

0.150

0.054

0.014

0.016

0.008

0.004

0°

0.229

0.010

0.393

0.157

0.068

0.019

0.049

0.009

0.009

7°

0.244

0.019

1.27 BSC

0.050 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOW ABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

1

8

9

16

–A

–

–B

–

K

C

G

–T

–

SEATING

PLANE

M

J

F

0.25 (0.010)

B

M

M

OUTLINE DIMENSIONS

Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabili-

ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit

described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which

may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may

vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s

technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.