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HLMP-CW72-LP0XX 数据表(PDF) 9 Page - AVAGO TECHNOLOGIES LIMITED

部件名 HLMP-CW72-LP0XX
功能描述  T-13/4 Precision Optical Performance White LED Lamps
Download  11 Pages
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制造商  AVAGO [AVAGO TECHNOLOGIES LIMITED]
网页  http://www.avagotech.com
标志 AVAGO - AVAGO TECHNOLOGIES LIMITED

HLMP-CW72-LP0XX 数据表(HTML) 9 Page - AVAGO TECHNOLOGIES LIMITED

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• If necessary, use fixture to hold the LED component in
proper orientation with respect to the PCB during
soldering process.
• At elevated temperature, the LED is more susceptible
to mechanical stress. Therefore, PCB must be allowed
to cool down to room temperature prior to handling,
which includes removal of jigs, fixtures or pallet.
LED Component
Plated Through
Lead Size
Diagonal
Hole Diameter
0.457 x 0.457 mm
0.646 mm
0.976 to 1.078 mm
(0.018 x 0.018 inch)
(0.025 inch)
(0.038 to 0.042 inch)
0.508 x 0.508 mm
0.718 mm
1.049 to 1.150 mm
(0.020 x 0.020 inch)
(0.028 inch)
(0.041 to 0.045 inch)
Avago Technologies LED Configuration
InGaN Device
CATHODE
Note: Electrical connection between bottom surface of LED die and
the lead frame material through conductive paste of solder.
• Over sizing of plated through hole can lead to twisting or
improper LED placement during auto insertion. Under
sizing plated through hole can lead to mechanical stress
on the epoxy lens during clinching.
Note: Refer to Application Note AN1027 for more information on
soldering LED components.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
• Recommended PC board plated through hole sizes for
LED component leads:
Precautions:
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced into the LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• For better control, it is recommended to use proper tool
to precisely form and cut the leads to applicable length
rather than doing it manually.
Soldering Conditions
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• The closest manual soldering distance of the soldering
heat source (soldering iron’s tip) to the body is 1.59 mm.
SolderingtheLEDcloserthan1.59mmmightdamagethe
LED.
• Recommended soldering conditions:
Manual Solder
Wave Soldering Dipping
Pre-heat Temperature 105
°C Max.
Pre-heat Time
30 sec Max.
Peak Temperature
250
°C Max.
260
°C Max.
Dwell Time
3 sec Max.
5 sec Max.
1.59 mm
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to daily
checkonthesolderingprofiletoensurethatthesoldering
profile is always conforming to recommended soldering
condition.
Notes:
1. PCB with different size and design (component density) will have
different head mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to recalibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies' high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is
advised to take extra precaution during wave soldering to ensure
that the maximum wave temperature is not exceeding 250
°C.
Overstressing the LED during soldering process might cause
premature failure to the LED due to delamination.


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