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HLMP-CW72-LP0XX 数据表(PDF) 9 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-CW72-LP0XX 数据表(HTML) 9 Page - AVAGO TECHNOLOGIES LIMITED |
9 / 11 page 9 • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • At elevated temperature, the LED is more susceptible to mechanical stress. Therefore, PCB must be allowed to cool down to room temperature prior to handling, which includes removal of jigs, fixtures or pallet. LED Component Plated Through Lead Size Diagonal Hole Diameter 0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm (0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch) 0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm (0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch) Avago Technologies LED Configuration InGaN Device CATHODE Note: Electrical connection between bottom surface of LED die and the lead frame material through conductive paste of solder. • Over sizing of plated through hole can lead to twisting or improper LED placement during auto insertion. Under sizing plated through hole can lead to mechanical stress on the epoxy lens during clinching. Note: Refer to Application Note AN1027 for more information on soldering LED components. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through hole sizes for LED component leads: Precautions: Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced into the LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. Soldering Conditions • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59 mm. SolderingtheLEDcloserthan1.59mmmightdamagethe LED. • Recommended soldering conditions: Manual Solder Wave Soldering Dipping Pre-heat Temperature 105 °C Max. – Pre-heat Time 30 sec Max. – Peak Temperature 250 °C Max. 260 °C Max. Dwell Time 3 sec Max. 5 sec Max. 1.59 mm • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to daily checkonthesolderingprofiletoensurethatthesoldering profile is always conforming to recommended soldering condition. Notes: 1. PCB with different size and design (component density) will have different head mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to recalibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies' high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature is not exceeding 250 °C. Overstressing the LED during soldering process might cause premature failure to the LED due to delamination. |
类似零件编号 - HLMP-CW72-LP0XX |
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类似说明 - HLMP-CW72-LP0XX |
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