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FAN5350MPX 数据表(PDF) 4 Page - Fairchild Semiconductor

部件名 FAN5350MPX
功能描述  3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging
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制造商  FAIRCHILD [Fairchild Semiconductor]
网页  http://www.fairchildsemi.com
标志 FAIRCHILD - Fairchild Semiconductor

FAN5350MPX 数据表(HTML) 4 Page - Fairchild Semiconductor

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© 2007 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN5350 Rev. 1.0.1
4
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Min.
Max.
Unit
Input Voltage with respect to GND
-0.3
6.0
V
VIN
Voltage on any other pin with respect to GND
-0.3
VIN
V
TJ
Junction Temperature
-40
150
°C
TSTG
Storage Temperature
-65
150
°C
TL
Lead Temperature (Soldering 10 Seconds)
260
°C
Human Body Model
4.5
kV
Charged Device Model
1.5
kV
ESD
Electrostatic Discharge Protection Level
Machine Model
200
V
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
Min.
Typ.
Max.
Unit
VCC
Supply Voltage Range
2.7
5.5
V
IOUT
Output Current
0
600
mA
L
Inductor
0.7
1.0
3.0
µH
CIN
Input Capacitor
3.3
4.7
12.0
µF
COUT
Output Capacitor
3.3
4.7
12.0
µF
TA
Operating Ambient Temperature
-40
+85
°C
TJ
Operating Junction Temperature
-40
+125
°C
Thermal Properties
Symbol
Parameter
Min.
Typ.
Max.
Units
ΘJA_WLCSP
Junction-to-Ambient Thermal Resistance
(2)
180
°C/W
ΘJA_MLP
Junction-to-Ambient Thermal Resistance
(2)
49
°C/W
Note:
2.
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with
four-layer 1s2p boards in accordance to JESD51- JEDEC standard. Special attention must be paid not to exceed
junction temperature TJ(max) at a given ambient temperate TA.


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