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TDA8552 数据表(PDF) 2 Page - NXP Semiconductors |
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TDA8552 数据表(HTML) 2 Page - NXP Semiconductors |
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2 / 28 page  1998 Jun 02 2 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing TDA8552T; TDA8552TS FEATURES • One pin digital volume control (for each channel) • Volume setting with up/down pulses • Auto repeat function on volume setting • Headphone sensing • Maximum gain set by selection pin • Low sensitivity for EMC radiation • Internal feedback resistors • Flexibility in use • Few external components • Low saturation voltage of output stage • Standby mode controlled by CMOS compatible levels • Low standby current • No switch-on/switch-off plops • High supply voltage ripple rejection • Protected against electrostatic discharge • Outputs short-circuit safe to ground, VDD and across the load • Thermally protected. APPLICATIONS • Portable consumer products • Notebook computers • Communication equipment. GENERAL DESCRIPTION The TDA8552T is a two channel audio power amplifier that provides an output power of 2 × 1.4 W into an 8 Ω load using a 5 V power supply. The circuit contains two BTL power amplifiers, two digital volume controls and standby/mute logic. Volume and balance of the amplifiers are controlled using two digital input pins which can be driven by simple push-buttons or by a microcontroller. Using the selection pin (GAINSEL) the maximum gain can be set at 20 or 30 dB. The headphone sense input (HPS) can be used to detect if a headphone is plugged into the jack connector. If a headphone is plugged into the jack connector the amplifier switches from the BTL to the SE mode and the BTL loudspeakers are switched off. This also results in a reduction of quiescent current consumption. The TDA8552T is contained in a 20-pin small outline package. For the TDA8552TS, which is contained in a 20-pin very small outline package, the maximum output power is limited by the maximum allowed ambient temperature. More information can be found in Section “Thermal design considerations”. The SO20 package has the four corner leads connected to the die pad so that the thermal behaviour can be improved by the PCB layout. ORDERING INFORMATION TYPE NUMBER PACKAGE NAME DESCRIPTION VERSION TDA8552T SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 TDA8552TS SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1 |
类似零件编号 - TDA8552 |
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类似说明 - TDA8552 |
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