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TDA8000T 数据表(PDF) 11 Page - NXP Semiconductors |
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TDA8000T 数据表(HTML) 11 Page - NXP Semiconductors |
11 / 24 page 1996 Dec 12 11 Philips Semiconductors Product specification Smart card interface TDA8000; TDA8000T Fig.10 Power derating curve (DIP28). handbook, halfpage 4 3 1 0 2 MBE256 50 0 50 100 150 Ptot (W) T ( C) amb o Fig.11 Power derating curve (SO28). handbook, halfpage 50 3 2 1 0 0 MBE255 50 100 150 Ptot (W) T ( C) amb o HANDLING Each pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining. Method 3015 (HBM 1500 Ω, 100 pF) 3 pulses positive and 3 pulses negative; on each pin referenced to ground. THERMAL CHARACTERISTICS SYMBOL PARAMETER VALUE UNIT Rth j-a thermal resistance from junction to ambient in free air SOT117-1 30 K/W SOT136-1 70 K/W |
类似零件编号 - TDA8000T |
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类似说明 - TDA8000T |
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