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AM158-G 数据表(PDF) 1 Page - Comchip Technology |
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AM158-G 数据表(HTML) 1 Page - Comchip Technology |
1 / 2 page Page1 Comhip Technology Corporation . Tel:510-657-8671 . Fax: 510-657-8921 . www.comchiptech.com Case: Reliable low cost construction utilizing molded plastic technique results in inexpensive product Terminals: Lead solderable per MIL-STD-202, Method 208 Polarity: Polarity symbols marking on body Weight: 0.05 ounce, 1.3 grams Available with 0.50 inch leads (P/N add Suffix “S”) Mechanical Data: Maximum Ratings and Electrical Characteristics Ratings to 1000V PRV Surge overloadrating - 30/50 amperes peak Ideal for printed circuited board Reliable construction utilizing molded plastic Mounting position: Any Features: Voltage: 50 ~ 1000 Volts Current: 1.0 ~ 1.5 Amp AM100-G/150-G thru AM1010-G/1510-G Silicon Miniature Single-Phase Bridge “-G” suffix designated RoHS compliant version For capacitive load, derate current by 20% Maximum Recurrent Peak Reverse Voltage Maximum RMS Bridge input Voltage Maximum DC Blocking Voltage AM100 Maximum Average Forward Rectified Current at TA=50ºC Peak Forward Surge Current, 8.3ms single half sine-wave superimposed on rated load Maximum Forward Voltage Drop per Bridge Element at 1.0A DC Maximum Reverse Current at Rated TA=25ºC DC Blocking Voltage per element TA=100ºC I 2t Rating for fusing (t<8.35ms) Typical Junction Capacitance per leg (Note1) CJ Typical Thermal resistance per leg (Note 2) RθJA Typical Thermal resistance per leg (Note 2) RθJL Operating Temperature Range TJ Storage Temperature Range TA AM100-G AM101-G AM102-G AM104-G AM106-G AM108-G AM1010-G AM150-G AM151-G AM152-G AM154-G AM156-G AM158-G AM1510-G 50 100 200 400 600 800 100 35 70 140 280 420 560 700 50 100 200 400 600 800 1000 1.0 1.5 30 50 1.0 10.0 1.0 10 24 36 13 -55 to +125 -55 to +150 Units V V V A A V uA mA A2S pF ºC/W ºC ºC Rating at 25ºC ambient temperature unless otherless specified Single phase, half wave, 60Hz, Resistive or inductive load. Notes: 1. Measured at 1 MHz and applied reverse voltage of 4.0 Volts 2. Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B with 0.47x0.47 (12x12mm) copper pads .200 (5.6) .180 (4.6) .200 (5.6) .180 (4.6) .217 (5.5) .197 (5.0) 1.2MIN (30.5) 1.0MIN (25.4) .358 (9.1) MAX AM .032 (8.1) .030(7.6) DIA POS. LEAD |
类似零件编号 - AM158-G |
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类似说明 - AM158-G |
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