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ISL28286 数据表(PDF) 10 Page - Intersil Corporation |
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ISL28286 数据表(HTML) 10 Page - Intersil Corporation |
10 / 15 page 10 FN6312.0 September 22, 2006 FIGURE 35. + SLEW RATE vs TEMPERATURE VS = ±2.5V INPUT = ±0.75V AV = 2 FIGURE 36. - SLEW RATE vs TEMPERATURE VS = ±2.5V INPUT = ±0.75V AV = 2 FIGURE 37. AVOL CH A vs TEMPERATURE RL = 100K VO = ±2V VS = ±2.5V FIGURE 38. AVOL CH B vs TEMPERATURE RL = 100K VO = ±2V VS = ±2.5V FIGURE 39. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE FIGURE 40. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE Typical Performance Curves (Continued) 0.09 0.11 0.13 0.15 0.17 0.19 0.21 0.23 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) n = 12 MIN MEDIAN MAX 0.1 0.11 0.12 0.13 0.14 0.15 0.16 0.17 -40 -20 0 204060 80 100 120 TEMPERATURE (°C) n = 12 MIN MEDIAN MAX 100 200 300 400 500 600 700 800 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) n = 12 MIN MEDIAN MAX 150 300 450 600 750 -40 -20 0 20406080 100 120 TEMPERATURE (°C) n = 12 MIN MEDIAN MAX 893mW θ JA = 11 2°C /W QS O P1 6 1.4 1.2 1 0.8 0.6 0.2 0 0 255075 100 150 AMBIENT TEMPERATURE (°C) 125 85 JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0.4 633mW θ JA =1 58° C/W QS OP 16 1.2 1 0.8 0.6 0.4 0 0 25 50 75 100 150 AMBIENT TEMPERATURE (°C) 125 85 JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0.2 ISL28286, ISL28486 |
类似零件编号 - ISL28286 |
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类似说明 - ISL28286 |
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