FAN1585A

PRODUCT SPECIFICATION

8

REV. 1.1.6 7/8/05

Figure 14. Application Circuit (FAN1585A)

Table 1. Bill of Materials for Application Circuit for the FAN1585A

Figure 15. Application Circuit (FAN1585A-1.5)

Table 2. Bill of Materials for Application Circuit for the FAN1585A-1.5

Item

Quantity

Manufacturer

Part Number

Description

C1

1

Xicon

L10V22

22µF, 10V Aluminum

C2, C3

2

Xicon

L10V100

100µF, 10V Aluminum

R1

1

Generic

124

Ω, 1%

R2

1

Generic

24.9

Ω, 1%

U1

1

Fairchild

FAN1585AT

5A Regulator

Item

Quantity

Manufacturer

Part Number

Description

C1

1

Xicon

L10V22

22µF, 10V Aluminum

C3

1

Xicon

L10V100

100µF, 10V Aluminum

U1

1

Fairchild

FAN1585AT-1.5

5A Regulator

FAN1585A

U1

ADJ

C2

100

µF

R2

24.9

Ω

R1

124

Ω

+

C3

100

µF

1.5V

+

C1

22

µF

+

3.3V

FAN1585A-1.5

U1

GND

C3

100

µF

1.5V

+

C1

22

µF

+

3.3V

Junction-to-case thermal resistance is specified from the IC

junction to the bottom of the case directly below the die. This

is the lowest resistance path for heat flow. Proper mounting

ensures the best thermal flow from this area of the package to

the heat sink. Use of a thermally conductive material at the

case-to-heat sink interface is recommended. Use a thermally

conductive spacer if the case of the device must be electri-

cally isolated and include its contribution to the total thermal

resistance. The cases of the FAN1585A series are directly

connected to the output of the device.