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AM29F016D-120DGI1 数据表(PDF) 10 Page - Advanced Micro Devices |
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AM29F016D-120DGI1 数据表(HTML) 10 Page - Advanced Micro Devices |
10 / 12 page June 11, 2002 Am29F016D Known Good Die 9 SU P P L E MEN T PHYSICAL SPECIFICATIONS Die Dimensions, X x Y . . . . 186.61 mils x 208.66 mils . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.74 mm x 5.30 mm Die Thickness . . . . . . . . . . . . . . . . . . . . . . . . ~20 mils . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .500 µm Bond Pad Size . . . . . . . . . . . . . . 3.52 mils x 3.52 mils . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89.3 µm x 89.3 µm Pad Area Free of Passivation . . . . . . . . . .15.52 mils2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10,000 µm2 Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 Bond Pad Metalization . . . . . . . . . . . . . . . . . . Al/Cu/Si Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal, may be grounded (optional) Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride DC OPERATING CONDITIONS VCC (Supply Voltage) . . . . . . . . . . . . . . . 4.5 V to 5.5 V Junction Temperature Under Bias . . TJ (max) = 130°C Operating Temperature Commercial . . . . . . . . . . . . . . . . . . . 0 °C to +70°C Industrial . . . . . . . . . . . . . . . . . . . –40 °C to +85°C MANUFACTURING INFORMATION Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . FASL Wafer Sort Test . . . . . . . . . . . . . . . . . . Sunnyvale, CA . . . . . . . . . . . . . . . . . . . . . . . . and Penang, Malaysia Manufacturing ID . . . . . . . . . . . . . . . . . . . . . 98J32AK Preparation for Shipment . . . . . . . . Penang, Malaysia Fabrication Process . . . . . . . . . . . . . . . . . . . CS49HS Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 SPECIAL HANDLING INSTRUCTIONS Processing Do not expose KGD products to ultraviolet light or process them at temperatures greater than 250 °C. Failure to adhere to these handling instructions will result in irreparable damage to the devices. For best yield, AMD recommends assembly in a Class 10K clean room with 30% to 60% relative humidity. Storage Store at a maximum temperature of 30 °C in a nitrogen- purged cabinet or vacuum-sealed bag. Observe all standard ESD handling procedures. |
类似零件编号 - AM29F016D-120DGI1 |
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类似说明 - AM29F016D-120DGI1 |
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