Micrel, Inc.

SY88973BL

February 2007

5

M9999-020207-A

Absolute Maximum Ratings

(1)

REF Current ................................................................±1mA

LOS Current ................................................................±5mA

DOUT, /DOUT Current..............................................±25mA

DIN, /DIN Current......................................................±10mA

Lead Temperature (soldering, 20sec.)....................... 260°C

Operating Ratings

(2)

Package Thermal Resistance

MLF

®

DC Electrical Characteristics

Symbol

Parameter

Condition

Min

Typ

Max

Units

Power Supply Current

Note 4

Note 5

28

45

42

62

mA

mA

REF Voltage

V

LOSLVL Voltage Range

V

Output HIGH Voltage

Note 6

V

Output LOW Voltage

Note 6

V

Differential Output Offset

Note 6

±80

mV

Single-Ended Output Impedance

40

50

60

Ω

Single-Ended Input Impedance

40

50

60

Ω

TTL DC Electrical Characteristics

Symbol

Parameter

Condition

Min

Typ

Max

Units

LOS Output Leakage

100

uA

LOS Output LOW Level

Sinking 2mA

0.5

V

/EN Input HIGH Voltage

2.0

V

/EN Input LOW Voltage

0.8

V

/EN Input HIGH Current

20

100

µA

µA

/EN Input LOW Current

–300

uA

Notes:

1. Permanent device damage may occur if Absolute Maximum Ratings are exceeded. This is a stress rating only and functional operation is not implied

at conditions other than those detailed in the operational sections of this data sheet. Exposure to Absolute Maximum Rating conditions for extended

periods may affect device reliability.

2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

3. Thermal performance assumes the use of 4-layer PCB. Exposed pad must be soldered (or equivalent) to the device's most negative potential on the

PCB.

4. Excludes current of CML output stage. See “Detailed Description.”

5. Total device current with no output load.

mode.