NBSG86AMNG datasheet(5/14 Pages) ONSEMI

部件名	NBSG86AMNG

功能描述	2.5V/3.3V SiGe Differential Smart Gate with Output Level Select

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制造商	ONSEMI [ON Semiconductor]

网页	http://www.onsemi.com

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NBSG86A

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Table 7. Interfacing Options

INTERFACING OPTIONS

CONNECTIONS

CML

Connect VTD0, VTD1, VTSEL and VTD0, VTD1 to VCC

LVDS

Connect VTD0, VTD1, VTD0 and VTD1 together. Leave VTSEL open.

AC−COUPLED

Bias VTD0, VTD1, VTSEL and VTD0, VTD1 Inputs within (VIHCMR) Common Mode Range

RSECL, PECL, NECL

Standard ECL Termination Techniques

LVTTL, LVCMOS

An external voltage should be applied to the unused complementary differential input.

Nominal voltage 1.5 V for LVTTL and VCC/2 for LVCMOS inputs.

Table 8. ATTRIBUTES

Characteristics

Value

Internal Input Pulldown Resistors

(R1)

75 k

W

Internal Input Pullup Resistor

(R2)

37.5 k

W

ESD Protection

Human Body Model

Machine Model

Charged Device Model

> 1 KV

> 50 V

> 4 KV

Moisture Sensitivity (Note 6)

16−FCBGA

16−QFN

Level 3

Level 1

Flammability Rating

Oxygen Index: 28 to 34

UL 94 V−0 @ 0.125 in

Transistor Count

364

Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

6. For additional information, see Application Note AND8003/D.

Table 9. MAXIMUM RATINGS (Note 7)

Symbol

Parameter

Condition 1

Condition 2

Rating

Units

VCC

Positive Power Supply

VEE = 0 V

3.6

V

VEE

Negative Power Supply

VCC = 0 V

−3.6

V

VI

Positive Input

Negative Input

VEE = 0 V

VCC = 0 V

VI v VCC

VI w VEE

3.6

−3.6

V

VINPP

Differential Input Voltage |Dn − Dn|

VCC − VEE w 2.8 V

VCC − VEE < 2.8 V

2.8

|VCC − VEE|

V

IIN

Input Current Through RT (50 W Resistor)

Static

Surge

45

80

mA

Iout

Output Current

Continuous

Surge

25

50

mA

TA

Operating Temperature Range

16−FCBGA

16−QFN

−40 to +70

−40 to +85

°C

Tstg

Storage Temperature Range

−65 to +150

°C

qJA

Thermal Resistance (Junction−to−Ambient)

(Note 8)

0 LFPM

500 LFPM

0 LFPM

500 LFPM

16 FCBGA

16 QFN

108

86

41.6

35.2

°C/W

qJC

Thermal Resistance (Junction−to−Case)

2S2P (Note 8)

2S2P (Note 9)

16 FCBGA

16 QFN

5.0

4.0

°C/W

Tsol

Wave Solder

Pb (BGA)

Pb (QFN)

Pb−Free (QFN)

< 15 sec

< 3 sec @ 248

°C

< 3 sec @ 260

°C

225

265

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

7. Maximum Ratings are those values beyond which device damage may occur.

8. JEDEC standard multilayer board − 2S2P (2 signal, 2 power).

9. JEDEC standard multilayer board − 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.

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