BYD31 datasheet(4/9 Pages) PHILIPS

部件名	BYD31

功能描述	Fast soft-recovery controlled avalanche rectifiers

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制造商	PHILIPS [NXP Semiconductors]

网页	http://www.nxp.com

标志

4 / 9 page

1996 Sep 18

4

Not recommended for new designs

Philips Semiconductors

Product speciﬁcation

Fast soft-recovery

controlled avalanche rectiﬁers

BYD31 series

THERMAL CHARACTERISTICS

Note

1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer

≥40 µm, see Fig.11.

For more information please refer to the

“General Part of associated Handbook”.

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

Rth j-tp

thermal resistance from junction to tie-point

lead length = 10 mm

180

K/W

Rth j-a

thermal resistance from junction to ambient

note 1

250

K/W

类似零件编号 - BYD31

制造商	部件名	数据表	功能描述
NXP Semiconductors	BYV36	78Kb / 14P	Fast soft-recovery controlled avalanche rectifiers 1996 Jul 01
	BYW95	54Kb / 8P	Fast soft-recovery controlled avalanche rectifiers 1996 Jun 07
	BYD37	65Kb / 12P	Fast soft-recovery controlled avalanche rectifiers 1999 Nov 16
	BYD52	51Kb / 8P	Fast soft-recovery controlled avalanche rectifiers 1998 Dec 03
	BYV96	54Kb / 8P	Fast soft-recovery controlled avalanche rectifiers 1996 Jun 07
	BYD33	65Kb / 12P	Fast soft-recovery controlled avalanche rectifiers 1996 Sep 18
New Jersey Semi-Conduct...	BYW95	141Kb / 2P	Fast soft-recovery controlled avalanche rectifiers
NXP Semiconductors	BYD53	81Kb / 12P	Fast soft-recovery controlled avalanche rectifiers 1998 Dec 04
	BYM26	70Kb / 12P	Fast soft-recovery controlled avalanche rectifiers 1996 May 24
	BYM36	78Kb / 14P	Fast soft-recovery controlled avalanche rectifiers 1996 Sep 18