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MC33030DWG 数据表(PDF) 4 Page - ON Semiconductor |
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MC33030DWG 数据表(HTML) 4 Page - ON Semiconductor |
4 / 17 page MC33030 http://onsemi.com 4 ELECTRICAL CHARACTERISTICS (continued) (VCC = 14 V, TA = 25°C, unless otherwise noted.) Characteristic Symbol Min Typ Max Unit WINDOW DETECTOR Input Hysteresis Voltage (V1 − V4, V2 − V3, Figure 18) VH 25 35 45 mV Input Dead Zone Range (V2 − V4, Figure 18) VIDZ 166 210 254 mV Input Offset Voltage ( ⎢[V2 − VPin 2] − [VPin 2 − V4]⎟ Figure 18) VIO − 25 − mV Input Functional Common−Mode Range (Note 3) Upper Threshold Lower Threshold VIH VIL − − (VCC − 1.05) 0.24 − − V Reference Input Self Centering Voltage Pins 1 and 2 Open VRSC − (1/2 VCC) − V Window Detector Propagation Delay Comparator Input, Pin 3, to Drive Outputs VID = 0.5 V, RL(DRV) = 390 W tp(IN/DRV) − 2.0 − ms OVERCURRENT MONITOR Overcurrent Reference Resistor Voltage (Pin 15) ROC 3.9 4.3 4.7 V Delay Pin Source Current VDLY = 0 V, ROC = 27 k, IDRV = 0 mA IDLY(source) − 5.5 6.9 mA Delay Pin Sink Current (ROC = 27 k, IDRV = 0 mA) VDLY = 5.0 V VDLY = 8.3 V VDLY = 14 V IDLY(sink) − − − 0.1 0.7 16.5 − − − mA Delay Pin Voltage, Low State (IDLY = 0 mA) VOL(DLY) − 0.3 0.4 V Overcurrent Shutdown Threshold VCC = 14 V VCC = 8.0 V Vth(OC) 6.8 5.5 7.5 6.0 8.2 6.5 V Overcurrent Shutdown Propagation Delay Delay Capacitor Input, Pin 16, to Drive Outputs, VID = 0.5 V tp(DLY/DRV) − 1.8 − ms POWER H−SWITCH Drive−Output Saturation (− 40 °C p TA p+ 85°C, Note 4) High−State (Isource = 100 mA) Low−State (Isink = 100 mA) VOH(DRV) VOL(DRV) (VCC − 2) − (VCC − 0.85) 0.12 − 1.0 V Drive−Output Voltage Switching Time (CL = 15 pF) Rise Time Fall Time tr tf − − 200 200 − − ns Brake Diode Forward Voltage Drop (IF = 200 mA, Note 4) VF − 1.04 2.5 V TOTAL DEVICE Standby Supply Current ICC − 14 25 mA Overvoltage Shutdown Threshold (− 40 °C p TA p + 85°C) Vth(OV) 16.5 18 20.5 V Overvoltage Shutdown Hysteresis (Device “off” to “on”) VH(OV) 0.3 0.6 1.0 V Operating Voltage Lower Threshold (− 40 °C p TA p + 85°C) VCC − 7.5 8.0 V 3. The upper or lower hysteresis will be lost when operating the Input, Pin 3, close to the respective rail. Refer to Figure 4. 4. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient temperature as possible. |
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