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FEATURES

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TPA4411RTJ

INR

INL

PGND

OUTL

PVSS

SVSS

C1N

PVDD

SGND

A1

B1

C1

D1

A2

A3

A4

SDL

SVDD

C1P

SDR

NC

NC

OUTR

TPA4411YZH

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TPA4411MRTJ

DESCRIPTION

APPLICATIONS

TPA4411

TPA4411M

SLOS430C – AUGUST 2004 – REVISED DECEMBER 2006

80-mW DIRECTPATH™ STEREO HEADPHONE DRIVER

• Space Saving Packages

–

20-Pin, 4 mm

× 4 mm Thin QFN

–

TPA4411 – Thermally Optimized

PowerPAD™ Package

–

TPA4411M – Thermally Enhanced

PowerPAD™ Package

–

16-Ball, 2.18 mm

× 2.18 mm WCSP

• Ground-Referenced Outputs Eliminate

DC-Bias Voltages on Headphone Ground Pin

–

No Output DC-Blocking Capacitors

–

Reduced Board Area

–

Reduced Component Cost

–

Improved THD+N Performance

–

No Degradation of Low-Frequency

Response Due to Output Capacitors

• Wide Power Supply Range: 1.8 V to 4.5 V

• 80-mW/Ch Output Power into 16-Ω at 4.5 V

• Independent Right and Left Channel

Shutdown Control

• Short-Circuit and Thermal Protection

The TPA4411 and TPA4411M are stereo headphone

• Pop Reduction Circuitry

drivers designed to allow the removal of the output

DC-blocking capacitors for reduced component count

and cost. The TPA4411 and TPA4411M are ideal for

small portable electronics where size and cost are

• Notebook Computers

critical design parameters.

• CD / MP3 Players

The TPA4411 and TPA4411M are capable of driving

• Smart Phones

80 mW into a 16-

Ω load at 4.5 V. Both TPA4411 and

• Cellular Phones

TPA4411M have a fixed gain of –1.5 V/V and

• PDAs

headphone outputs that have

±8-kV IEC ESD

protection. The TPA4411 and TPA4411M have

independent shutdown control for the right and left

audio channels.

The TPA4411 is available in a 2.18 mm

× 2.18 mm

WCSP and 4 mm

× 4 mm Thin QFN packages. The

TPA4411M is available in a 4 mm

× 4 mm Thin QFN

package. The TPA4411RTJ package is a thermally

optimized

PowerPAD™

package

allowing

the

maximum amount of thermal dissipation and the

TPA4411MRTJ is a thermally enhanced PowerPAD

package designed to match competitive package

footprints.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PowerPAD, DirectPath are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2004–2006, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.